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SM-J330G dump eMMc latest binary 3 Samsung J3 Pro (2017)

samsung j330g dump u3 sm-j300g dump binary 3 sm-j330g emmc File eMMC Tested Samsung J3 Pro (2017) SM-J330G SM-J330G Dump File Dead Boot Repair File
Assalamualaikum...
selamat sore temen temen semua nya , selamat datang kembali di website tercinta kita ini 💕
pada artikel kali ini saya merangkum file emmc samsung sm-j330g beserta fix baseband imei tanpa adanya backupan ,
jika bisa usahakan backup userpart agar imei aman tetapi jika emmc sudah mati tidak masalah kita lanjut saja, ikuti tutorial cara repair imei baseband exynos jika emmc mati tanpa backupan bawaan
cara isi seperti biasa kita siapkan emmc factory erase kemudian isi ext_csd userarea_512Mib,boot1 dan boot 2 , setelah selesai isi dump pasang emmc kalem saja
di karenakan file ini bukan full on jadi kita lakukan proses flashing
unduh file dump j330g bin 3:
eMMC_SM-J330G_ahmadservicecenter.com Size: 151MB
Unduh firmware disini :
SM-J330G (J330GDXU3CSG7)_XID.rar Size: 1.9GB password: wonggaptek
setelah flash , kemudian flash TWRP, masukan file
(no-verity-no-encrypt) lalu install lewat twrp
setelah selesai hidupkan (booting emang agak lama ya)
unduh file twrp dan dm verity disini:
twrp_3.3.1-1_sm-j330x_13819+no-verity-no-encrypt
jagan lupa sedekah
semoga bermanfaat
log info by ufi box :
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
 Card/BGA: BGA (Discrete embedded) - High density MMC
 Manufacturer ID: 0x15 (Samsung)
 Product name: QE63MB (0x514536334d42), rev: 0x00, serial number: 0xB755E404
 Manufacturing date: Sep 2017
CID: 15010051 4536334D 4200B755 E40494AA
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1) 
Partition info:
 Boot1: 4096 KiB
 Boot2: 4096 KiB
 RPMB: 16384 KiB
 User area: 14.68 GiB(15,758,000,128 bytes)
Cache size: 64 MiB
Partition configuration: 0x48
 Boot acknowledge is sent during the boot operation
 Boot partition 1 is enabled for boot
Partitioning support: 0x07
 Device support partitioning feature
 Device can have enhanced technological features
 Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x01
  Bus width: x4 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
 Power-on write protection: possible
 Permanent write protection: possible
 Lock status: not locked
User area write protection: 0x10
 Password protection features: enabled 
 Power-on write protection: possible
 Permanent write protection: not possible
 Lock status: not locked
ANDROID System Info:
 platform: exynos5, cpu abi: armeabi-v7a
 manufacturer: samsung
 board: universal7570, name: j3y17ltedx
 brand: samsung, model: SM-J330G
 build id: R16NW, version: 8.0.0 Oreo (R16NW.J330GDXU3BRH1)
 build description: j3y17ltedx-user 8.0.0 R16NW J330GDXU3BRH1 release-keys
crypto state: encrypted?
semoga done juga ya temen temenku

SM-J330G dump SM-J330G dump emmc
3 komentar
Batal
Comment Author Avatar
9/04/2024 12:12:00 AM
Pertanyaan kenapa saya tidak bisa flash twrp
Comment Author Avatar
9/04/2024 06:52:00 AM
Downgrade dulu ke Android 7.0 bang
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